Supersedes IPC/JEDEC J-STD .. Mass Reflow This standard applies to bulk solder reflow assembly by convection, convection/IR. Joint IPC/JEDEC Standard J-STD Page 1. STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW. SENSITIVE SURFACE. J-STDD. – Published August – Typos corrected 3/08 (Rev D.1). • J- STD – Published August • J-STDC. – Balloted within JEDEC & IPC.

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This may present an additional risk, which should be evaluated. Any SMD package that has not exceeded its? If the actual shelf life has exceeded 12 months, but less than 2 years, from the bag seal date and the humidity indicator card HIC see Clause 5. Light air evacuation may be used to reduce the packaging bulk and enhance carton packing Figure The bake times speci? The temperature and time for baking SMD packages are therefore limited by solderability considerations.

For a stacked die or BGA package with internal planes that impede moisture diffusion the actual bake time may be longer than that required in Table if packages have had extended exposure to factory ambient before bake. An equivalency evaluation is recommended to ensure that high temperature processing maintains moisture weight gain to an acceptable level. Marty Rodriguez, Jabil Circuit, Inc. We would like to thank them for their dedication to this effort.

I recommend changes to the following: The supplier should be consulted. Acceptable safe storage conditions for SMD packages classi? Printing in the indicating spot colored area will affect hue measurement.


Users may reduce the actual bake time if technically justi? Refer to Clause 6 for the baking of populated boards.

All testing occurs inside the chamber, while the cards are exposed to the test humidity. The percentage of change in hue from one humidity value to another is then calculated. If the time limit is exceeded the packages should be baked according to Table to restore the? The desiccant material shall be packaged in moisture permeable bags or pouches.

If the bag is to be resealed refer to Clause 4. The ip label includes? The heat absorbed by the package ipv from such operations is typically much lower than for bulk surface mount re? Drying per an allowable option resets the?

Although the body temperature during re? If a component is to be removed and reinstalled it may be necessary to?

The bags should be inspected to verify there are no holes, gouges, tears, punctures, or openings of any kind that would expose either the contents or an inner layer of a multilayer bag. Also the actual bake time may be reduced if technically justi?

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jexec The cards inside the chamber must be observable from outside the chamber. A solution for addressing this problem is kedec derate the exposure times based on the knowledge of moisture diffusion in the component packaging materials refer to JESDA Witness cards may be available from the HIC manufacturer if needed to con? HIC Testing Method To function properly, the spots must show a visually perceptible color change to indicate a change in the amount of humidity.

Other color schemes may be used. However, if the conditions of Clause 4. Set the chamber to the?



This table is applicable to SMDs molded with novolac, biphenyl, or multifunctional epoxy mold compounds. If partial lots are used, the remaining SMD packages j-std-0333b.1 be resealed or placed in safe storage within one hour of bag opening see Jdeec 5. By using these procedures, safe and damage-free re? Level 2 parts are still adequately dry. When this option is used, it must be veri? Heidi Reynolds, Oracle America, Inc.

This is particularly critical if SMD packages are handled under low humidity conditions j-atd-033b.1. Devices require bake, before mounting, if: Francois Monette, Cogiscan Inc.

Calculated shelf life in sealed bag: This method will minimize moisture related component damage. This will reset the? Table may be used as a guide in identifying an appropriate bake cycle. Standard Improvement Form The purpose of this form is to provide the Technical Committee of IPC with input from the industry regarding usage of the subject standard. Socketed components should be removed prior to rework.

If a higher bake temperature is required, SMD packages must be removed from the low temperature carriers to thermally safe carriers, baked, and returned to the j-ztd-033b.1 temperature carriers. It can occur due to misprocessing e.

Such SMD packages are not at risk and do not require moisture precautionary handling. Paper and Plastic Container Items An example HIC is shown in Figure